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US Browse · Hillsboro · Process Engineer

Process Engineer in Hillsboro

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Module Development Engineer - Cmp
Intel Retiree Medical Plan Trust
Hillsboro, Oregon, United States
Full time
Base: $133,800.00-255,200.00 usd; bonus/equity: st...
Hybrid
Mid-level
5+ years semiconductor industry experience
Bachelors degree in stem field
Hands-on process tuning and characterization
Engineers within Intel's Logic Technology Development organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century
42 days ago
Wla Yield Defect Metrology Engineer - Shift 5
Intel Retiree Medical Plan Trust
Hillsboro, Oregon, United States
Full time
Base: $99,030.00-139,810.00 usd; bonus/equity: sto...
**
Mid-level
Bachelor's or master's degree in stem field
2+ years metrology experience with bachelor's
Statistical analysis and data visualization skills
This role plays a pivotal part in driving yield enhancements across Intel's advanced process and packaging technologies
42 days ago
Process Support Engineer Iii - Ald
Applied Materials
Hillsboro, OR, US
Full time
Base: $108,000.00 - $148,500.00; bonus/equity: eli...
**
Mid-level
Bachelor's degree in engineering or related field
4-7 years experience in semiconductor fab
Strong interpersonal and communication skills
You will play a critical role in guiding products through their entire lifecycle from initial concept to final qualification
46 days ago
Module Development Engineer
Intel
Hillsboro, Oregon, United States
Full time
Base: $133,800.00-255,200.00 usd; bonus/equity: st...
On-site
Mid-level
Semiconductor processing and fabrication experience
Materials science or chemical engineering degree
Advanced transistor device structures knowledge
TD Module Development Engineers lead scientific research to enable the manufacture of innovative device architectures for high volume manufacturing
48 days ago
Advanced Packaging Td Plating Module Engineer
Intel
Hillsboro, Oregon, United States
Full time
Base: $155,520.00-219,550.00 usd; bonus/equity: st...
Onsite
Mid-level
Electrochemical plating processing experience
Fab process development expertise
Statistical process control knowledge
This role leads the plating process development and optimization for Intel's advanced packaging technology roadmap
48 days ago
Intel Foundry Module Development Engineer
Intel
Hillsboro, Oregon, United States
Full time
Base: $133,800.00-255,200.00 usd; bonus/equity: st...
Hybrid
Mid-level
Master's degree with 5+ years experience
Phd with 1+ years experience
Hands-on experimental research in stem
This position is in the Intel Foundry team working in one of the most advanced semiconductor process technologies in the world
48 days ago
Process Integration Development Engineer
Intel
Hillsboro, Oregon, United States
Full time
Base: $115,110.00-219,550.00 usd; bonus/equity: st...
On-site
Mid-level
Transmission electron microscopy operation
Phd or ms in materials science physics chemistry
3+ years related experience
The position involves characterizing semiconductor nano-devices using advanced transmission electron microscopy to expand analytical capabilities for Intel's Foundry labs
48 days ago
Module Development Engineer - Cmp
Intel
Hillsboro, Oregon, United States
Full time
Base: $133,800.00-255,200.00 usd; bonus/equity: st...
Hybrid
Mid-level
Chemical mechanical planarization process development
Semiconductor processing and fabrication experience
Materials science or chemical engineering background
Engineers within Intel's Logic Technology Development organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century
48 days ago
Module Process Engineer Iii - (e3)
Applied Materials
Hillsboro, OR, US
Full time
Base: $96,000.00 - $132,000.00; bonus/equity: elig...
Not specified
Mid-level
Metal deposition process experience
Wafer fab background required
Pvd cvd ald knowledge
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world
51 days ago
Advanced Packaging Td Plating Module Engineer
Intel Corporation
Hillsboro, Oregon, United States
Full time
Base: $155,520.00-219,550.00 usd; bonus/equity: st...
Mid-level
Electrochemical plating processing experience
Fab process development expertise
Statistical process control knowledge
This role leads the plating process development, optimizing equipment solutions and material selection for Intel's advanced packaging technology
51 days ago
Advanced Packaging Td Plating Module Engineer
Intel Retiree Medical Plan Trust
Hillsboro, Oregon, United States
Full time
Base: $155,520.00-219,550.00 usd; bonus/equity: st...
Mid-level
Electrochemical plating processing experience
Fab process development expertise
Statistical process control knowledge
This role leads the plating process development and optimization for Intel's advanced packaging technology, driving both high-volume manufacturing and future technology enablement
51 days ago
Process Integration And Development Engineer
Intel
Hillsboro, Oregon, United States
Full time
Base: $115,110.00-219,550.00 usd; bonus/equity: st...
On-site
Mid-level
Ph.d. in electrical engineering or related field
Experience with semiconductor reliability mechanisms
Knowledge of dielectric and interconnect reliability
This role focuses on defining integrated process solutions and conducting experiments aimed at enhancing semiconductor device quality, reliability, and manufacturability
51 days ago
Process Integration And Development Engineer
Intel
Hillsboro, Oregon, United States
Full time
Base: $115,110.00-219,550.00 usd; bonus/equity: st...
**
Mid-level
Ph.d. in electrical engineering or related field
Experience with semiconductor reliability mechanisms
Experience in semiconductor device fabrication
Join Intel as a Process Integration Development Engineer to shape the future of semiconductor technology through cutting-edge process development
52 days ago
Advanced Packaging Td Plating Module Engineer
Intel
Hillsboro, Oregon, United States
Full time
Base: $155,520.00-219,550.00 usd; bonus/equity: st...
**
Mid-level
Electrochemical plating processing experience
Master's degree in stem discipline
Statistical process control methodology
This role leads the plating process development and optimization for Intel's advanced packaging technology to drive high-volume manufacturing
52 days ago
Module Development Engineer - Cmp
Intel
Hillsboro, Oregon, United States
Full time
Base: $133,800.00-255,200.00 usd; bonus/equity: st...
**
Mid-level
Chemical mechanical planarization process development
Semiconductor processing and fabrication experience
Materials science or related stem degree
Engineers in the Logic Technology Development organization are tasked with continuing Moore's Law by innovating leading-edge fabrication processes
52 days ago
Module Development Engineer - Cmp
Intel
Hillsboro, Oregon, United States
Full time
Base: $133,800.00-255,200.00 usd; bonus/equity: st...
**
Mid-level
Chemical mechanical planarization process development
Semiconductor processing and fabrication experience
Materials science or chemical engineering background
Engineers within Intel's Logic Technology Development organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century
52 days ago
Process Integration And Development Engineer
Intel
Hillsboro, Oregon, United States
Full time
Base: $115,110.00-219,550.00 usd; bonus/equity: st...
On-site
Mid-level
Ph.d. in electrical engineering or related field
Experience with semiconductor reliability mechanisms
Experience in semiconductor device fabrication
This role focuses on defining integrated process solutions and conducting experiments aimed at enhancing semiconductor device quality and reliability
52 days ago
Module Development Engineer - Cmp
Intel Corporation
Hillsboro, Oregon, United States
Full time
Base: $133,800.00-255,200.00 usd; bonus/equity: st...
Hybrid
Mid-level
Chemical mechanical planarization process development
Semiconductor processing and fabrication experience
Materials science or chemical engineering background
Engineers within Intel's Logic Technology Development organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century
55 days ago
Principal Process Engineer
Qorvo Inc
Hillsboro, OR, US
On-site
Senior
Gaas technology thin films
Compound semiconductor technologies
Thin films deposition
Qorvo has an opening for a GaAs Technology Thin Films Principal Process Engineer at our Hillsboro, Oregon facility
56 days ago
Process Engineer I-iv
HITACHI HIGH-TECH AMERICA, INC.
Hillsboro, OR, United States
$64,811.80 - $146,963.71 annually; not specified; ...
**
Mid-level
Process development and optimization
Plasma etch process engineering
Semiconductor manufacturing processes
The Process Engineer I - IV position supports the business objectives of HTA’s Semiconductor Equipment Division (SED) related to sales of Reactive Ion Etch (RIE or Plasma Etch) equipment to the semiconductor industry
59 days ago
Senior Engineer I, Field Process
Asm
Hillsboro, Oregon, US
On-site
Senior
Ald, peald, pecvd, epitaxy, lpcvd processes
Thin film processing and characterization
Doe and statistical experiment design
Develop, optimize, and transfer innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes at customer sites
67 days ago
Principal Field Process Engineer
ASM
Hillsboro, Oregon, US
On-site
Senior
Technical authority and escalation owner
Customer-facing process applications
Advanced deposition processes and hardware
Own technical delivery and escalation for NPI of advanced deposition processes and hardware (thermal ALD, plasma ALD, Area Selective Deposition)
79 days ago
Senior Engineer I, Field Process, Ald
Asm
Hillsboro, Oregon, US
On-site
Senior
Ald, peald, pecvd, epitaxy, lpcvd processes
New product introduction (npi) support
Customer-facing technical link
As a Snr. Field Process Engineer, you will help expand ASM’s advanced film technologies at our customer’s Oregon site by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes
79 days ago

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Process Engineer in Hillsboro

Module Development Engineer - Cmp

Wla Yield Defect Metrology Engineer - Shift 5

Process Support Engineer Iii - Ald

Module Development Engineer

Advanced Packaging Td Plating Module Engineer

Intel Foundry Module Development Engineer

Process Integration Development Engineer

Module Development Engineer - Cmp

Module Process Engineer Iii - (e3)

Advanced Packaging Td Plating Module Engineer

Advanced Packaging Td Plating Module Engineer

Process Integration And Development Engineer

Process Integration And Development Engineer

Advanced Packaging Td Plating Module Engineer

Module Development Engineer - Cmp

Module Development Engineer - Cmp

Process Integration And Development Engineer

Module Development Engineer - Cmp

Principal Process Engineer

Process Engineer I-iv

Senior Engineer I, Field Process

Principal Field Process Engineer

Senior Engineer I, Field Process, Ald