Senior Electro-mechanical Engineer

Raytheon Australia

Andover, MA, USA
Base: 86,800 usd - 165,200 usd; bonus/equity: not ...
Hybrid
Electro-mechanical engineering design
Microelectronics packaging design
3dhi, 3d, and 2.5d packaging
Develop leading-edge miniaturized 3DHI sensors and systems to enable future generation technologies

Job Summary

  • Develop leading-edge miniaturized 3DHI sensors and systems to enable future generation technologies.
  • Work with cross-functional hardware engineering teams to develop advanced microelectronics packages and novel material and process solutions.
  • The salary range for this role is 86,800 USD - 165,200 USD.

Matching Summary

Develop leading-edge miniaturized 3DHI sensors and systems to enable future generation technologies.

Salary

Base: 86,800 USD - 165,200 USD; Bonus/Equity: Not specified; Benefits: Medical, dental, vision, 401(k) match, etc.

Skills & Requirements

Must-have

  • Electro-mechanical engineering design
  • Microelectronics packaging design
  • 3DHI, 3D, and 2.5D packaging
  • RF, digital, mixed-signal, photonics products
  • Circuit layout design using 2D CAD

Nice-to-have

  • Innovative attitude for R&D
  • Collaborative and fun team environment
  • Strong interpersonal skills
  • Ability to work independently and in a team

Key Requirements

  • Bachelor’s Degree in STEM Field
  • Minimum of Five (5) years of experience
  • Ability to obtain US security clearance
  • U.S. citizenship required

Work Rights

U.S. citizenship required

Tailored Resume

Cover Letter