8+ years in fab back-end or substrate manufacturing
Bachelor's or master's degree in science or engineering
Regular onsite presence at factories minimum three days per week
This role plays a pivotal part in shaping the future of advanced packaging technologies essential for next-generation AI devices
Job Summary
This role plays a pivotal part in shaping the future of advanced packaging technologies essential for next-generation AI devices.
The successful candidate will lead efforts to qualify new capacity at advanced packaging suppliers to ensure timely readiness for growing customer demand.
Collaboration involves working closely with diverse teams across Asia and the US while managing critical process interactions with on-site supplier engineering teams.
Matching Summary
Match Score: 75
This role plays a pivotal part in shaping the future of advanced packaging technologies essential for next-generation AI devices.
Skills & Requirements
Must-have
8+ years in fab back-end or substrate manufacturing
Bachelor's or Master's degree in Science or Engineering
Regular onsite presence at factories minimum three days per week
Experience with EMIB-T advanced packaging technology
Fluent business-level English communication skills
Nice-to-have
Strong understanding of substrate process building blocks
Experience qualifying process tools in TD/ramp context
Structured problem solving and situational leadership
Hands-on experience in yield improvement strategies
Ability to influence strategic decision-making at supplier levels
Key Requirements
PhD with 4+ years work experience OR Bachelor's/Master's with 8+ years
6+ years of experience in substrate manufacturing process development
Minimum three days per week onsite presence required