Senior Product Engineer (pkg Pe Mfg), Heterogeneous Integration Group(hig), High Bandwidth Memory (hbm) Product Engineering

Micron

Singapore, Singapore
5 years relevant engineering experience
Root cause analysis via efa and pfa
Yield improvement and dpm reduction
This role is part of a global team driving package and HBM product engineering activities focused on quality, cost, cycle time, and scale

Job Summary

  • This role is part of a global team driving package and HBM product engineering activities focused on quality, cost, cycle time, and scale.
  • The engineer will be accountable for improving assembly coverage to reduce field defects and enhance cumulative yield through cross-functional initiatives.
  • Candidates must possess strong leadership skills and the ability to make final decisions on risk analysis while mentoring team members.

Matching Summary

This role is part of a global team driving package and HBM product engineering activities focused on quality, cost, cycle time, and scale.

Skills & Requirements

Must-have

  • 5 years relevant engineering experience
  • Root cause analysis via EFA and PFA
  • Yield improvement and DPM reduction
  • Process conversion and HVM management
  • Cross-functional collaboration with Fab teams

Nice-to-have

  • AI/ML model development and deployment
  • Mentorship and team leadership skills
  • Project management expertise
  • Strong statistical data analysis capabilities
  • Innovation drive for competitive advantage

Key Requirements

  • Bachelor's or Master's in Electrical/Electronic/Mechanical Engineering
  • 5 years of relevant industry experience
  • Experience with circuit analysis and root cause resolution
  • Proficiency in statistics and data analysis scripting tools

Work Rights

Not specified

Tailored Resume

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